发明名称 |
THIN FILM DEPOSITION APPARATUS CLEANING METHOD, THIN FILM DEPOSITION METHOD, THIN FILM DEPOSITION APPARATUS AND PROGRAM |
摘要 |
PROBLEM TO BE SOLVED: To provide a thin film deposition apparatus cleaning method which can efficiently clean a thin film deposition apparatus.SOLUTION: A thin film deposition apparatus cleaning method comprises performing a cleaning process of supplying a cleaning gas containing a hydrogen fluoride to a reaction tube 2 to remove attached substances attached to the inside of the apparatus. In the cleaning process, a temperature in the reaction tube 2 is set at a temperature different from a temperature in the reaction tube 2 for depositing thin films on a semiconductor wafer W. The cleaning method further comprises performing an oxidation process of supplying oxygen radicals to the reaction tube 2 to oxidize a silicon fluoride attached to the inside of the apparatus; and subsequently, performing an oxide removal process of supplying a cleaning gas containing a hydrogen fluoride to the reaction tube 2 to remove the oxidized silicon fluoride. The oxidation process and the oxide removal process are repeated a plurality of times. By doing this, a thin film deposition apparatus 1 is efficiently cleaned. |
申请公布号 |
JP2013145919(A) |
申请公布日期 |
2013.07.25 |
申请号 |
JP20130084275 |
申请日期 |
2013.04.12 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
SATO JUN;KIKUCHI KIYOTAKA;MURAKAMI HIROKI;NAKAJIMA SHIGERU;HASEBE KAZUHIDE |
分类号 |
H01L21/316;C23C16/44;H01L21/3065;H01L21/31 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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