发明名称 |
Methods and Apparatus for a Substrate Core Layer |
摘要 |
A structure for a core layer of a substrate and a method for fabricating a core layer of a substrate are disclosed. The core layer comprises a molding compound encapsulating a die or a plurality of dies, a dielectric layer on the surfaces of the molding compound, and a conductive layer on top of the dielectric layer. A through hole is formed through the dielectric layer and the molding compound, which may be filled with a metal plate. A laser via is formed similarly. Build-up layers may be assembled next to the core layer to form the substrate, which can be used to package dies.
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申请公布号 |
US2013186676(A1) |
申请公布日期 |
2013.07.25 |
申请号 |
US201213355128 |
申请日期 |
2012.01.20 |
申请人 |
YU FEI;MOHAMMED ANWAR A.;NIU RUI;FUTUREWEI TECHNOLOGIES, INC. |
发明人 |
YU FEI;MOHAMMED ANWAR A.;NIU RUI |
分类号 |
H05K1/09;H05K1/00;H05K1/16;H05K3/00;H05K3/46 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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