发明名称 STRUCTURE AND METHOD OF Tinv SCALING FOR HIGH k METAL GATE TECHNOLOGY
摘要 A complementary metal oxide semiconductor structure including a scaled nFET and a scaled pFET which do not exhibit an increased threshold voltage and reduced mobility during operation is provided. The method includes forming a plasma nitrided, nFET threshold voltage adjusted high k gate dielectric layer portion within an nFET gate stack, and forming at least a pFET threshold voltage adjusted high k gate dielectric layer portion within a pFET gate stack. The pFET threshold voltage adjusted high k gate dielectric layer portion in the pFET gate stack can also be plasma nitrided. The plasma nitrided, nFET threshold voltage adjusted high k gate dielectric layer portion contains up to 15 atomic % N2 and an nFET threshold voltage adjusted species, while the plasma nitrided, pFET threshold voltage adjusted high k gate dielectric layer portion contains up to 15 atomic % N2 and a pFET threshold voltage adjusted species.
申请公布号 US2013187239(A1) 申请公布日期 2013.07.25
申请号 US201313793682 申请日期 2013.03.11
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHUDZIK MICHAEL P.;GUO DECHAO;KRISHNAN SIDDARTH A.;KWON UNOH;RADENS CARL J.;SIDDIQUI SHAHAB
分类号 H01L27/092 主分类号 H01L27/092
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