| 发明名称 |
SINTERABLE SILVER FLAKE ADHESIVE FOR USE IN ELECTRONICS |
| 摘要 |
A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6 g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition. |
| 申请公布号 |
US2013187102(A1) |
申请公布日期 |
2013.07.25 |
| 申请号 |
US201313799002 |
申请日期 |
2013.03.13 |
| 申请人 |
HENKEL AG & CO. KGAA;HENKEL CORPORATION;HENKEL CORPORATION;HENKEL AG & CO. KGAA |
发明人 |
KUDER HARRY RICHARD;SANCHEZ JULIET GRACE;CAO XINPEI;GROSSMANN MATTHIAS |
| 分类号 |
C09J9/02 |
主分类号 |
C09J9/02 |
| 代理机构 |
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