| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer container which can house a semiconductor wafer without breakage even when the semiconductor wafer has a different thickness or the semiconductor wafer warps.SOLUTION: A semiconductor wafer container 1a comprises: a tray 2 on which a semiconductor wafer 9 is mounted; a bumper bag 12a mounted on the semiconductor wafer 9; upper-stage trays 2 stacked on the tray 2; and a laminate bag 10 covering a tray group in which the plural trays 2 are stacked. The bumper bag 12a expands so as to contact the upper-stage trays 2 when the laminate bag 10 is vacuumed, thereby pressing and fixing the semiconductor wafer 9 to the tray 2. |
