| 摘要 |
PROBLEM TO BE SOLVED: To provide a CSP type surface acoustic wave device in which bonding strength is high between a surface acoustic wave element and a mounting board.SOLUTION: A surface acoustic wave device 1 includes a surface acoustic wave element 20 having a plurality of electrode pads 23, bumps 30 composed of Au and formed on the electrode pads 23, and a mounting board 10. The surface acoustic wave element 20 is flip-chip mounted on the die attach surface 10a of the mounting board 10. The mounting board 10 has at least one resin layer 12a-12c having a via hole 10e formed therein, a plurality of mounting electrodes 11 formed on the die attach surface 10a of the mounting board 10, and a via hole conductor 14a. At least the surface layer of the mounting electrode 11 is composed of Au. The mounting electrode 11 is bonded to the electrode pad 23 by means of the bump 30. The via hole conductor 14a is formed in the via hole 10e. At least one of the via hole conductors 14a is placed below the bump 30. |
