METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of improving a yield while suppressing a cost of manufacture.SOLUTION: A method of manufacturing a semiconductor device includes: forming an element isolation insulating film 6 on a silicon (semiconductor) substrate 1; forming a conductive film on the element isolation insulating film 6; and patterning the conductive film by first etching and second etching to obtain a conductive pattern 13a. A condition of the second etching is that deposit 90 deposited on a lateral face 13e of the conductive pattern 13a by the second etching is more than that deposited on the lateral face 13e by the first etching.