发明名称 |
HYBRID ELECTRICAL CONTACTS |
摘要 |
Devices having hybrid-vertical contacts. In certain embodiments, a substrate includes a lower patterned layer that has a target conductor. A hybrid-vertical contact may be disposed directly on the target conductor. The hybrid vertical contact may include a lower-vertical contact directly on the target conductor and an upper-vertical contact directly on the lower-vertical contact. The upper-vertical contact may have an upper width that is greater than a lower width of the lower-vertical contact.
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申请公布号 |
US2013187212(A1) |
申请公布日期 |
2013.07.25 |
申请号 |
US201313777890 |
申请日期 |
2013.02.26 |
申请人 |
MICRON TECHNOLOGY, INC.;MICRON TECHNOLOGY, INC. |
发明人 |
DOEBLER JONATHAN |
分类号 |
H01L49/02 |
主分类号 |
H01L49/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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