发明名称 HYBRID ELECTRICAL CONTACTS
摘要 Devices having hybrid-vertical contacts. In certain embodiments, a substrate includes a lower patterned layer that has a target conductor. A hybrid-vertical contact may be disposed directly on the target conductor. The hybrid vertical contact may include a lower-vertical contact directly on the target conductor and an upper-vertical contact directly on the lower-vertical contact. The upper-vertical contact may have an upper width that is greater than a lower width of the lower-vertical contact.
申请公布号 US2013187212(A1) 申请公布日期 2013.07.25
申请号 US201313777890 申请日期 2013.02.26
申请人 MICRON TECHNOLOGY, INC.;MICRON TECHNOLOGY, INC. 发明人 DOEBLER JONATHAN
分类号 H01L49/02 主分类号 H01L49/02
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