发明名称 METHODS OF HEATING INTEGRATED CIRCUITS AT LOW TEMPERATURES AND DEVICES USING THE METHODS
摘要 A method of heating an integrated circuit (IC) may include sensing a temperature of the IC, comparing the sensed temperature with a reference temperature and generating a comparison signal; and enabling a heating element that heats the IC based on the comparison signal. An IC may include a thermal sensor configured to sense a temperature of the IC, compare the sensed temperature with a reference temperature, and generate a comparison signal. The IC may include a heating element configured to be enabled to heat the IC based on the comparison signal. An IC may include a heating element and a thermal sensor. The sensor may be configured to sense a temperature of the IC and generate a control signal based on the sensed temperature and a reference temperature. The element may be enabled to heat the IC or disabled from heating the IC based on the control signal.
申请公布号 US2013187157(A1) 申请公布日期 2013.07.25
申请号 US201313743814 申请日期 2013.01.17
申请人 KIM MI SOOK;PARK SHIN KYU 发明人 KIM MI SOOK;PARK SHIN KYU
分类号 H01L23/34 主分类号 H01L23/34
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