发明名称 |
COMPONENT HAVING A THROUGH-CONNECTION |
摘要 |
A method is described for manufacturing a component having a through-connection. The method includes providing a substrate; forming a trench structure in the substrate, a substrate area which is completely surrounded by the trench structure being produced; forming a closing layer for closing off the trench structure, a cavity girded by the closing layer being formed in the area of the trench structure; removing substrate material from the substrate area surrounded by the closed-off trench structure; and at least partially filling the substrate area surrounded by the closed-off trench structure with a metallic material. A component having a through-connection is also described.
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申请公布号 |
US2013189483(A1) |
申请公布日期 |
2013.07.25 |
申请号 |
US201313744611 |
申请日期 |
2013.01.18 |
申请人 |
REINMUTH JOCHEN;BERGMANN YVONNE;ROBERT BOSCH GMBH |
发明人 |
REINMUTH JOCHEN;BERGMANN YVONNE |
分类号 |
H05K13/00 |
主分类号 |
H05K13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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