| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition suitable for forming a solder resist that can suppress surface roughness of a cured film as well as warpage of a substrate and has excellent folding resistance.SOLUTION: The photosensitive resin composition comprises (A) an acid-modified ethylenically unsaturated group-containing polyurethane resin, (B) a radical polymerizable compound, (C) a thermal crosslinking agent, (D) a photopolymerization initiator and (E) a defoaming agent. In the composition, the (A) polyurethane resin has a partial structure expressed by general formula (U1), and the (E) defoaming agent includes a defoaming agent having a silicone skeleton and/or a defoaming agent comprising a polymer having a fluorine-substituted group. In general formula (U1), Lrepresents a divalent connecting group including neither an ethylenically unsaturated group nor a carboxyl group. |
