| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module which reduces heat resistance while maintaining insulation reliability.SOLUTION: A power module includes: a metal cooling plate; an insulation layer formed on the metal cooling plate and made of an inorganic component which does not include a resin component; a metal conductor plate bonded to the insulation layer through a resin layer; and a semiconductor element connected with the metal conductor plate by a joining member. |
