BONDING MATERIAL AND BONDING METHOD IN WHICH SAID BONDING MATERIAL IS USED

摘要

The purpose of the present invention is to enable highly-reliable bonding of bonding surfaces to be carried out such that the occurrence of uneven drying at the center and ends of the bonding surfaces, which occurs in-plane on a bonding layer in a desolvation process of a preliminary drying step, is reduced, thereby ensuring that the bonding surfaces do not detach even if repeatedly exposed to heat shock after bonding. This bonding material, which solves the aforementioned problem, is characterized by being covered by organic matter with a carbon number of six or less, comprising main silver particles, and covered by organic matter with a carbon number of six or less, comprising nano silver particles having an average primary particle size of 10 to 30 nm, and sub silver particles. The bonding material is further characterized by containing nano silver particles with an average primary diameter of 100 to 200 nm, two types of solvents with different boiling points, and a dispersant.