| 发明名称 |
MICRO ELECTRO MECHANICAL SYSTEM STRUCTURES |
| 摘要 |
A micro electro mechanical system (MEMS) structure includes a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein. A second substrate structure is bonded with the bonding pad structure of the first substrate structure. |
| 申请公布号 |
US2013187245(A1) |
申请公布日期 |
2013.07.25 |
| 申请号 |
US201213353765 |
申请日期 |
2012.01.19 |
| 申请人 |
CHIEN TING-YING;CHIU YI HSUN;SU CHING-HOU;NI CHYI-TSONG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHIEN TING-YING;CHIU YI HSUN;SU CHING-HOU;NI CHYI-TSONG |
| 分类号 |
H01L29/84 |
主分类号 |
H01L29/84 |
| 代理机构 |
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代理人 |
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| 主权项 |
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