METHOD FOR FORMING SEALED ELECTRICAL FEEDTHROUGHS THROUGH AN ENCAPSULATION PACKAGE AND ELCAPSULATION PACKAGE PROVIDED WITH AT LEAST ONE SUCH ELECTRICAL FEEDTHROUGH

摘要

PURPOSE: A method for forming a sealed electrical feedthrough passing through an encapsulation package and the encapsulation package with at least one such electrical feedthrough are provided to offer the electrical feedthrough caused by an electrical connection originating from a component. CONSTITUTION: A through opening (31) is formed on the bottom (20) of a package. A plate (30) made of co-fired ceramic with an electrical connection part is soldered onto the opening. The co-fired ceramic plate is soldered to a wall and the bottom of the package in a face-to-face way. The package is made of a FeNiCo alloy.