| 摘要 |
PROBLEM TO BE SOLVED: To rapidly lower temperature of a heating plate when a substrate is mounted on the heating plate and is subjected to heat treatment.SOLUTION: Two pieces of cooling plates 81 and 82 with substantially the same size as that of a heating plate 84 are horizontally disposed on a lower side of the heating plate 84. The lower cooling plate 81 is fixed to the heating plate 84 via a heat insulation member, and the upper cooling plate 82 is configured such that it can be moved up and down with respect to the lower cooling plate 81. The lower cooling plate 81 comprises a coolant passage 88. The upper cooling plate 82 is cooled in advance by bringing it into contact with the lower cooling plate 81. When temperature of the heating plate 84 is lowered, the upper cooling plate 82 is lifted so as to be brought into contact with or moved closer to the heating plate 84. Alternatively, a single piece of a cooling plate comprising the coolant passage 88 may be brought into contact with or moved closer to the heating plate 84, instead of using the two pieces of cooling plates 81 and 82. |
