LASER BEAM CUTTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a laser beam cutting device capable of drilling a small hole without moving a processing head.SOLUTION: In a laser beam cutting device 1, a processing head 2 is arranged above a workpiece W such as a metal plate while a processing stage 4 is arranged below it. Laser beam L is radiated from an opening of the processing head 2 equipped with a condenser lens 11 to the workpiece W, for cutting processing. The processing head 2 includes a lens moving means 15 which moves the condenser lens 11 that is held. By driving the lens moving means 15 without moving the processing head 2, a focal point of the laser beam L is moved within the range of an opening of the processing head 2, to process the workpiece W.