| 摘要 |
A connection structure of a housing of an electronic apparatus and a connection method of forming a housing, both of which are able to secure a desired strength by integrally combining even end surfaces of an opening edge portion of a thin-wall housing into one piece with ultrasonic welding is disclosed herein. The connection structure of the housing of the electronic apparatus is formed by matching end surfaces of opening edge portions of a first case and a second case and integrally combining the end surfaces into one piece in a welding manner. Particularly, a welding protrusion rim protruding along an end surface of an opening edge portion of the second case is melted to be welded on a welding fitting groove, on which a crimp process is performed along an end surface of an opening edge portion of the first case, for integration into one piece.
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