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发明名称
CRACK STOPPER ON UNDER-BUMP METALLIZATION LAYER
摘要
A semiconductor die includes a crack stopper on an under-bump metallization (UBM) layer. The crack stopper is in the shape of hollow cylinder with at least two openings.
申请公布号
US2013187277(A1)
申请公布日期
2013.07.25
申请号
US201213443556
申请日期
2012.04.10
申请人
CHEN YU-FENG;LIN CHUN-HUNG;PU HAN-PING;TUNG CHIH-HANG;WU KAI-CHIANG;HO MING-CHE;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
发明人
CHEN YU-FENG;LIN CHUN-HUNG;PU HAN-PING;TUNG CHIH-HANG;WU KAI-CHIANG;HO MING-CHE
分类号
H01L23/48
主分类号
H01L23/48
代理机构
代理人
主权项
地址
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