发明名称 |
LAMINATE AND COPPER-CLAD LAMINATE USING SAME |
摘要 |
<p>Provided is a surface-treated copper foil for copper-clad laminate, where the copper foil adheres favorably to resin and leaves the resin with outstanding transparency after the copper foil is removed by etching. In the surface-treated copper foil for copper-clad laminate, roughening particles are formed on the surface of the copper foil by means of a roughening treatment. The average roughness (Rz) of the roughening treatment surface is 0.5-1.3 µm. The gloss of the roughening treatment surface is 0.5-68, and the ratio (A/B) of the surface area (A) of the roughening particles to the area (B) obtained when the roughening particles are viewed in plan view from the copper foil surface side, is 2.00-2.45.</p> |
申请公布号 |
WO2013108414(A1) |
申请公布日期 |
2013.07.25 |
申请号 |
WO2012JP55592 |
申请日期 |
2012.03.05 |
申请人 |
JX NIPPON MINING & METALS CORPORATION;ARAI, HIDETA;MIKI, ATSUSHI |
发明人 |
ARAI, HIDETA;MIKI, ATSUSHI |
分类号 |
C25D7/06;B32B15/08;H05K1/09 |
主分类号 |
C25D7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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