发明名称 THERMOELECTRIC ELEMENT AND THERMOELECTRIC MODULE PROVIDED WITH SAME
摘要 <p>The thermoelectric element (10) is provided with: p-type and n-type semiconductor elements (21, 22) having an upper end surface and a lower end surface; a bottom electrode (12) joined to the lower end surface of the mutually adjacent p-type and n-type semiconductor elements (21, 22) so as to connect the latter to one another, the junction section being of smaller surface area than the lower end surface; and a junction portion (13) formed by solder, having a surface junction portion (13b) in which the opposed surfaces of the bottom electrode (12) and of the lower end surface of the p-type and n-type semiconductor elements (21, 22) are mutually joined, and a fillet portion (13a) formed so as to fill in the space around the mutually intersecting lower end surface and the side surface of the bottom electrode (12) which constitute a shoulder portion formed by the lower end surface and the bottom electrode (12).</p>
申请公布号 WO2013108518(A1) 申请公布日期 2013.07.25
申请号 WO2012JP81984 申请日期 2012.12.10
申请人 KELK LTD. 发明人 KONNAI, MITSUOKI;KONISHI, AKIO
分类号 H01L35/32;H01L35/08 主分类号 H01L35/32
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