AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an aqueous dispersion for chemical mechanical polishing capable of achieving both a high-polishing speed and suppression of corrosion generation to an aluminum film and its alloy film at a semiconductor device manufacturing step, and of showing a good storage stability, and provide a chemical mechanical polishing method using the same.SOLUTION: An aqueous dispersion for chemical mechanical polishing contains: (A) 0.1 mass% or more and 10 mass% or less of abrasive grains; and (B) 0.01 mass% or more and 2 mass% or less of a phosphate ester compound having a 1-5C organic group. The pH is 1 or more and 4 or less.