| 摘要 |
PROBLEM TO BE SOLVED: To provide lithography equipment advantageous in terms of a throughput.SOLUTION: Lithography equipment performing alignment of a substrate on the basis of a result obtained by measuring a position of an alignment mark formed on the substrate to form a pattern on the substrate, includes: an acquisition unit for acquiring first requirement alignment accuracy in a first direction and second requirement alignment accuracy in a second direction different from the first direction; and a control unit for determining a first condition for first measurement processing measuring a position of the alignment mark in the first direction, according to the first requirement alignment accuracy, and determining a second condition for second measurement processing measuring a position of the alignment mark in the second direction, according to the second requirement alignment accuracy, and controls the execution of the first measurement processing according to the first condition, and controls the execution of the second measurement processing according to the second condition. |
