发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SAME
摘要 <p>A semiconductor device includes a first conductive-type semiconductor layer, a second conductive-type body region formed in a surficial portion of the semiconductor layer, a first conductive-type source region formed in a surficial portion of the body region, a gate insulating film provided on the semiconductor layer and containing nitrogen atoms, the gate insulating film including a first portion in contact with the semiconductor layer outside the body region, a second portion in contact with the body region, and a third portion in contact with the source region, and a gate electrode provided on the gate insulating film in an area extending across the semiconductor layer outside the body region, the body region, and the source region. The third portion of the gate insulating film has a thickness greater than the thickness of the first portion and the thickness of the second portion.</p>
申请公布号 EP2618380(A1) 申请公布日期 2013.07.24
申请号 EP20110825229 申请日期 2011.09.15
申请人 ROHM CO., LTD. 发明人 OKUMURA, KEIJI;MIURA, MINEO;NAGAO, KATSUHISA;MITANI, SHUHEI
分类号 H01L29/78;H01L21/336;H01L29/12 主分类号 H01L29/78
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