发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT
摘要 <p>The positive-type photosensitive resin composition according to the present invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound that produces an acid by light, a thermal crosslinking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.</p>
申请公布号 EP2618216(A1) 申请公布日期 2013.07.24
申请号 EP20110825006 申请日期 2011.09.02
申请人 HITACHI CHEMICAL CO., LTD. 发明人 TANIMOTO AKITOSHI;NOBE SHIGERU;KASUYA KEI;MATSUTANI HIROSHI;UENO TAKUMI;AOKI YU;TAHARA SHINGO
分类号 G03F7/075;G03F7/004;G03F7/023;H01L21/027 主分类号 G03F7/075
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