| 摘要 |
PROBLEM TO BE SOLVED: To provide the mounting structure of and a manufacturing method for a bare chip or a chip-sized package having high connection reliability. SOLUTION: An electrode pad 3 of a semiconductor device 1 is connected to an electrode pad 4 of a wiring board 2 via conductive resin bumps 7, formed between the pads 3 and 4, the conductive resin bumps 7 being made of a plurality of conductive grains 5 each comprising a surface coating conductive layer 9 and a core-forming third resin 8, and second resins 10. A gap between the semiconductor device 1 and the wiring board 2 is sealed with a first resin 6, which has elasticity higher than that of the conductive resin bumps 7. COPYRIGHT: (C)2009,JPO&INPIT |
