| 摘要 |
A resin composition sheet for encapsulating electronic parts and a method of producing an electronic part apparatus using the sheet are provided. The method includes: loading, on a substrate, a resin composition sheet for encapsulating electronic parts including a thermosetting resin composition containing an epoxy resin, a phenol resin, an inorganic filler, and a curing accelerator, having a lowest viscosity in a specific range, and a thickness in a specific range; heating the substrate in a chamber in a decompressed state to sag an end portion of the sheet until it is in contact with a surface of the substrate; and releasing a pressure in the chamber to cause the sheet to adhere onto the substrate due to a difference between a pressure in the space between the sheet and the substrate, and the pressure in the chamber after the release, followed by thermal curing. |
