| 摘要 |
<p>The present invention concerns a method for manufacturing a product such as a dual interface card inlay, wherein said method comprises the steps of providing a card inlay (1) with a antenna (3) having contact pads (5); forming a recess (6) in said inlay (1) for receiving a chip module (2) with contacts (4); and applying at least one insert (7) to create an electrical contact between a contact (4) of the module (2) and a contact pad (5) of the antenna (3). The present invention also concerns a product, such as a dual interface card, produced according to this method.</p> |
