| 摘要 |
PURPOSE: An electronic device and a manufacturing method thereof are provided to fix an integrated circuit structure to a substrate by mutually connecting a solder pattern and the rear surface of the integrated circuit structure. CONSTITUTION: An electronic (200) comprises a wiring pattern (23), an integrated circuit structure (27), and a solder pattern (31). Two of the wiring patterns are formed in parallel on the surface of a substrate with a gap. The integrated circuit structure is arranged on one end of the wiring pattern and is electrically connected to the one end of the wiring pattern. The solder pattern includes a first solder pattern (31a) and a second solder pattern (31b). The first solder pattern is crossed with the other end of the wiring pattern. The second solder pattern is expanded in order to be filled from the first solder pattern to the gap of the one end of the wiring pattern at a height of the wiring pattern and is connected to the integrated circuit structure so that the integrated circuit structure is electrically connected to the one end of the wiring pattern. |
