| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of producing electronic parts at low cost without using organic solvent which involves disposal problem, the method employing wet etching polyimide insulation layer of sheet laminate using dry film, the laminate having a conductive inorganic layer and an insulation layer. <P>SOLUTION: The insulation layer in the laminate is wet etchable laminate structure having one or more insulating unit layers, all the layers consisting of polyimide resin. The patterning of insulating layers is conducted by a method of wet etching a laminate of dry film resist. The laminate of dry film is patterned using exposure and developing. Thereafter, the laminate of dry film undergoes one of the process selected from a group of ultraviolet irradiation treatment, heat treatment, and a combination of ultraviolet irradiation treatment and heat treatment in order to improve the dry film resist of the insulation layer in resistance to etchant. <P>COPYRIGHT: (C)2012,JPO&INPIT |
