| 摘要 |
Conventional semiconductor devices have a problem that it is difficult to prevent the short circuit between chips and to improve accuracy in temperature detection with the controlling semiconductor chips. In a semiconductor device of the present invention, a first mount region to which a driving semiconductor chip is fixedly attached and a second mount region to which a controlling semiconductor chip is fixedly attached are formed isolated from each other. A projecting area is formed in the first mount region, and the projecting area protrudes into the second mount region. The controlling semiconductor chip is fixedly attached to the top surfaces of the projecting area and the second mount region by use of an insulating adhesive sheet material. This structure prevents the short circuit between the two chips, and improves accuracy in temperature detection with the controlling semiconductor chip. |
