A FILM REMOVAL METHOD FOR DFSR

摘要

PURPOSE: A film removing method for dry film solder resist (DFSR) is provided to maximize removing efficiency by removing in the locus of a worker pulling with two hands. CONSTITUTION: A film (105) is adhered to a surface and a rear surface. Arranging is performed by being supplied with a PCB (100). The position of film is accurately confirmed. The adhering position of a label paper (110) is selected by the confirmation. The PCB with the film removed is transferred to a discharging position.