发明名称 Method of forming side wall spacers for a semiconductor device
摘要 An etching stopper film is formed over a first insulating film. Then, a second insulating film is formed with a thickness that allows concave and convex portions formed due to a first gate electrode to remain. Then, anisotropic etching is performed using the etching stopper film as a stopper to remove the second insulating film over a second gate electrode and form a first side wall spacer of the first gate electrode. Then, the etching stopper film is removed. Then, anisotropic etching is performed on the first insulating film to form a second side wall spacer over the second gate electrode and form a third side wall spacer which is disposed inside the first side wall spacer over the first gate electrode.
申请公布号 US8492227(B2) 申请公布日期 2013.07.23
申请号 US20100837901 申请日期 2010.07.16
申请人 MITSUIKI AKIRA;INADA ATSURO;RENESAS ELECTRONICS CORPORATION 发明人 MITSUIKI AKIRA;INADA ATSURO
分类号 H01L21/8234;H01L21/311 主分类号 H01L21/8234
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