发明名称 Trenched Schottky diode and method of forming a trenched Schottky diode
摘要 A Schottky diode with a small footprint and a high-current carrying ability is fabricated by forming an opening that extends into an n-type semiconductor material. The opening is then lined with a metallic material such as platinum. The metallic material is then heated to form a salicide region where the metallic material touches the n-type semiconductor material.
申请公布号 US8492255(B2) 申请公布日期 2013.07.23
申请号 US20110986107 申请日期 2011.01.06
申请人 HAYNIE SHELDON D.;GABRYS ANN;NATIONAL SEMICONDUCTOR CORPORATION 发明人 HAYNIE SHELDON D.;GABRYS ANN
分类号 H01L21/28 主分类号 H01L21/28
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