发明名称 PATTERN FORMING PROCESS AND RESIST COMPOSITION
摘要 PURPOSE: A patterning method is provided to have a small line width roughness and excellent resolution, and to form a resist pattern with few defects after a development. CONSTITUTION: A patterning method comprises a step of spreading a resist material on a substrate; a step of exposing a resist film by high energy rays after a heat treatment; and a step of obtaining a positive pattern in which a non-exposed part is not dissolved, by dissolving an exposed part by using an alkali developer solution after a heat treatment. The resist material comprises a polymer compound which has a repeating unit in which a carboxylic group is substituted by an acid-unstable group and an acid generator; or a polymer compound which has a repeating unit generating acid by exposure and a repeating unit in which a carboxylic group is substituted by an acid-unstable group, a sulfonate of a fluoroalkyl sulfonamide, or iodine salt; and an organic solvent.
申请公布号 KR20130083856(A) 申请公布日期 2013.07.23
申请号 KR20130003287 申请日期 2013.01.11
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 OHASHI MASAKI;HATAKEYAMA JUN
分类号 G03F7/039;G03F7/26 主分类号 G03F7/039
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