INSULATING MATERIAL FOR ELECTRONIC DEVICE

摘要

PURPOSE: An insulating material for an electronic device is provided to be able to be able to suppress the damage of an electronic device due to the high temperature curing process of the insulating material, and to show an excellent physical property and reliability. CONSTITUTION: An insulating material for an electronic device includes soluble polyimide resin including a repeating unit of Chemical formula 1. The insulating material for an electronic device shows more than 70% of imidization rate after being hardened at a temperature of 250deg.C or less, and includes a low boiling point solvent with a boiling point of 130-180deg.C as a residual solvent. The outgassing generation rate after hardening the insulating material is 4 ppm or less to the total weight of a soluble polyimide resin, and the residual solvent amount during the outgassing is 0.1 ppm or less.