发明名称 |
Reflow apparatus, a reflow method, and a manufacturing method of a semiconductor device |
摘要 |
A reflow apparatus, where formic acid is used for cleaning a surface of a solder electrode on a processing target, is disclosed. The reflow apparatus includes a processing chamber, a formic acid introduction mechanism for supplying an atmosphere gas containing formic acid to the processing chamber, and a shielding member that is made of a material having corrosion resistance against formic acid. The shielding member is arranged between a reflow processing section of the processing chamber and an inner wall of the processing chamber. In place of or in addition to the shielding member, the reflow apparatus may include a heater for decomposing residual formic acid.
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申请公布号 |
US8490857(B2) |
申请公布日期 |
2013.07.23 |
申请号 |
US201213436843 |
申请日期 |
2012.03.31 |
申请人 |
MATSUI HIROYUKI;MATSUKI HIROHISA;OTAKE KOKI;FUJITSU SEMICONDUCTOR LIMITED |
发明人 |
MATSUI HIROYUKI;MATSUKI HIROHISA;OTAKE KOKI |
分类号 |
B23K1/00;H01L21/44 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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