发明名称 |
BUMPLESS BUILD-UP LAYER AND LAMINATED CORE HYBRID STRUCTURES AND METHODS OF ASSEMBLING SAME |
摘要 |
A structure includes a hybrid substrate for supporting a semiconductive device that includes a bumpless build-up layer in which the semiconductive device is embedded and a laminated-core structure. The bumpless build-up layer and the laminated-core structure are rendered an integral apparatus by a reinforcement plating that connects to a plated through hole in the laminated-core structure and to a subsequent bond pad of the bumpless build-up layer structure. |
申请公布号 |
KR20130083933(A) |
申请公布日期 |
2013.07.23 |
申请号 |
KR20137016535 |
申请日期 |
2011.11.23 |
申请人 |
INTEL CORP. |
发明人 |
MANUSHAROW MATHEW J.;HLAD MARK S.;NALLA RAVI K. |
分类号 |
H01L23/485;H05K3/46 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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