SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to protect a storage element part or an element forming layer below a resin layer from dust by covering one surface with resin and maintain the mechanical intensity of the semiconductor device. CONSTITUTION: A release layer is formed on a first substrate (778). An element forming layer is formed on the release layer. A storage element part (789,790) and an antenna (786) are formed on the element forming layer. A resin layer is formed on the element forming layer, the storage element unit, and the antenna. A second substrate is formed on the resin layer. The first substrate is separated from the element forming layer using the second substrate. The element forming layer is in contact with a third substrate having a support with an adhesive layer therebetween. The second substrate and the support are removed.