| 发明名称 |
Plasma processing apparatus |
| 摘要 |
A diameter of a mounting unit of the stage of an ashing processing apparatus is less than a diameter of a mounting unit of the stage of an etching processing apparatus, and the diameter of the mounting unit of the stage of the etching processing apparatus is less than a diameter of an objective item.
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| 申请公布号 |
US8491751(B2) |
申请公布日期 |
2013.07.23 |
| 申请号 |
US201213457082 |
申请日期 |
2012.04.26 |
| 申请人 |
KOBAYASHI HIROYUKI;IZAWA MASARU;HITACHI HIGH-TECHNOLOGIES CORPORATION |
发明人 |
KOBAYASHI HIROYUKI;IZAWA MASARU |
| 分类号 |
C23F1/00;B05C13/00;C23C16/00;H01L21/306 |
主分类号 |
C23F1/00 |
| 代理机构 |
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代理人 |
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