发明名称 Electronic device enclosure
摘要 An electronic device enclosure includes a convex bottom plate, a first side plate connected to a first side of the convex bottom plate, and a second side plate connected to a second side of the convex bottom plate. An electronic component is attached to the convex bottom plate. A horizontal plane is defined by connecting bottom edges of the first side plate and the second side plate, and a distance is defined between a highest point of the convex bottom plate and the horizontal plane. The distance is in a range of about 0.7 mm to about 1.4 mm.
申请公布号 US8493719(B2) 申请公布日期 2013.07.23
申请号 US201113106876 申请日期 2011.05.13
申请人 LI NAI-JUAN;WU ZHI-PING;NAN XU-DONG;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 LI NAI-JUAN;WU ZHI-PING;NAN XU-DONG
分类号 H05K5/00 主分类号 H05K5/00
代理机构 代理人
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