发明名称 |
Electronic device enclosure |
摘要 |
An electronic device enclosure includes a convex bottom plate, a first side plate connected to a first side of the convex bottom plate, and a second side plate connected to a second side of the convex bottom plate. An electronic component is attached to the convex bottom plate. A horizontal plane is defined by connecting bottom edges of the first side plate and the second side plate, and a distance is defined between a highest point of the convex bottom plate and the horizontal plane. The distance is in a range of about 0.7 mm to about 1.4 mm.
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申请公布号 |
US8493719(B2) |
申请公布日期 |
2013.07.23 |
申请号 |
US201113106876 |
申请日期 |
2011.05.13 |
申请人 |
LI NAI-JUAN;WU ZHI-PING;NAN XU-DONG;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
LI NAI-JUAN;WU ZHI-PING;NAN XU-DONG |
分类号 |
H05K5/00 |
主分类号 |
H05K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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