发明名称 |
Low viscosity electrostatic discharge (ESD) dissipating adhesive |
摘要 |
In one embodiment, a system includes a cable comprising a plurality of leads and an ESD dissipating adhesive coupled to the plurality of leads in a coverage area for providing ESD protection to an element of an electronic device. The ESD adhesive comprises a mixture of a polymeric thin film and electrically conductive fillers dispersed in the film, and the ESD adhesive has a resistivity from about 50 to 100 MOmega. In another embodiment, a method for providing ESD protection to an element of an electronic device includes applying an ESD adhesive across exposed leads of a cable and evaporating the solvent from the ESD adhesive. At least some of the leads are coupled to an element of an electronic device. The ESD adhesive comprises a polymeric thin film, electrically conductive fillers dispersed in the polymeric thin film, and a solvent for controlling a viscosity of the ESD adhesive.
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申请公布号 |
US8493699(B2) |
申请公布日期 |
2013.07.23 |
申请号 |
US20100852428 |
申请日期 |
2010.08.06 |
申请人 |
BANDY, IV WILLIAM T.;BODAY DYLAN J.;IBEN ICKO E. T.;MCKINLEY WAYNE A.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BANDY, IV WILLIAM T.;BODAY DYLAN J.;IBEN ICKO E. T.;MCKINLEY WAYNE A. |
分类号 |
H02H3/22 |
主分类号 |
H02H3/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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