发明名称 Low viscosity electrostatic discharge (ESD) dissipating adhesive
摘要 In one embodiment, a system includes a cable comprising a plurality of leads and an ESD dissipating adhesive coupled to the plurality of leads in a coverage area for providing ESD protection to an element of an electronic device. The ESD adhesive comprises a mixture of a polymeric thin film and electrically conductive fillers dispersed in the film, and the ESD adhesive has a resistivity from about 50 to 100 MOmega. In another embodiment, a method for providing ESD protection to an element of an electronic device includes applying an ESD adhesive across exposed leads of a cable and evaporating the solvent from the ESD adhesive. At least some of the leads are coupled to an element of an electronic device. The ESD adhesive comprises a polymeric thin film, electrically conductive fillers dispersed in the polymeric thin film, and a solvent for controlling a viscosity of the ESD adhesive.
申请公布号 US8493699(B2) 申请公布日期 2013.07.23
申请号 US20100852428 申请日期 2010.08.06
申请人 BANDY, IV WILLIAM T.;BODAY DYLAN J.;IBEN ICKO E. T.;MCKINLEY WAYNE A.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BANDY, IV WILLIAM T.;BODAY DYLAN J.;IBEN ICKO E. T.;MCKINLEY WAYNE A.
分类号 H02H3/22 主分类号 H02H3/22
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