SOLDERBALL ATTACH METHOD AND APPARATUS USING SAME

摘要

PURPOSE: A solder ball attach method and an apparatus thereof are provided to maintain uniform size of a completed bump by excluding physical contact in the process of settling a solder ball in an accommodation hole of an attach mask. CONSTITUTION: A substrate is fixed to a substrate chuck. Flux is dotted in a number of positions which are pattern-arranged to settle a solder ball (mB) in the substrate. An attach mask (90) is fixed to the upper side of the substrate as being arranged. A number of solder balls are dropped down on the surface of the attach mask of the substrate chuck from a solder ball supply unit (140). The substrate chuck vibrates so that the solder ball dropped on the surface of the attach mask is settled in an accommodation hole. The attach mask is separated by being moved separately from the substrate.