发明名称 VEHICLE-MOUNTED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a vehicle-mounted electronic component with reduced size and weight and reduced manufacturing cost.SOLUTION: The vehicle-mounted electronic component includes a case 2, and an electronic component body housed in a housing space in the case 2. through-holes 23, 25, 27, 29 are formed to the case 2 to pass through the housing space from an upper face 10 of the case. Water shut-off walls 41-44 are vertically disposed on the upper face 10 of the case 2 to regulate immersion of water into the through-holes 23, 25, 27, 29. Even though the through-holes 23, 25, 27, 29 are formed to pass through the housing space from the upper face 10 of the case 2, the water shut-off walls 41-44 formed on the upper face 10 of the case 2 regulates the immersion of water into the through-holes 23, 25, 27, 29 to prevent the immersion of water into the housing space through the through-holes 23, 25, 27, 29.
申请公布号 JP2013141941(A) 申请公布日期 2013.07.22
申请号 JP20120004106 申请日期 2012.01.12
申请人 HONDA ELESYS CO LTD 发明人 ONISHI MOTOYASU
分类号 B60R16/02 主分类号 B60R16/02
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