| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for electroplating a long conductive substrate having a smooth copper plating film layer without concentrated minute convexes and to provide a method for manufacturing a copper clad laminate that is made by using the method for electroplating the long conductive substrate.SOLUTION: A method for electroplating a long conductive substrate in which electroplating is applied on a surface of conductive layer thereof, the method comprises the steps of: transferring the long conductive substrate with the conductive layer on its surface in a roll-to-roll method; and repeating immersion of the long conductive substrate into an electroplating solution filled in an electroplating bath in which a plurality of positive electrodes are disposed along the transferring path of the long conductive substrate at positions opposing to the long conductive substrate. At the top end in the transferred direction, the long conductive substrate comprises a long insulated substrate via a connection portion, and is transferred into the electroplating bath from the long insulated substrate at the top. After immersion of the long insulation substrate at the top and the connection portion into the electroplating solution, energization of the positive electrode opposing to the long conductive substrate starts between the moment when the top of the conductive layer of the long conductive substrate is immerged into the electroplating solution and the moment when the top of the conductive layer is transferred to a 10% length of the opposing positive electrode. |
