INTEGRATED DIGITAL- AND RADIO-FREQUENCY SYSTEM-ON-CHIP DEVICES WITH INTEGRAL PASSIVE DEVICES IN PACKAGE SUBSTRATES, AND METHODS OF MAKING SAME

摘要

Functionality of front-end module radio frequency (RF) devices is divided between a hybrid system on chip (SoC) that includes a digital processor and an RF integrated circuit device (DP-RFIC device), and a package substrate for the hybrid device. Methods of assembling include forming inductors and transformers integral to the package substrate and mounting the DP-RFIC device in proximity to the inductors and transformers.