METHOD OF POLISHING THE BACKSURFACE OF WAFER AND WAFER MANUFACTURED BY THE SAME

摘要

PURPOSE: A method for polishing the rear of a wafer is provided to reduce rough grinding time by processing the wafer through two rough grinding operations. CONSTITUTION: A wafer is mounted on a standby table (210). The wafer is arranged (220). The wafer is processed by a first rough grinding operation (230). The wafer is processed by a second rough grinding operation (240). The wafer is processed by a fine grinding operation (250). The wafer is polished (260). The wafer is unloaded (270). [Reference numerals] (210) Loading a wafer; (220) Arranging a wafer; (230,240) First and second rough grinding operations; (250) Fine grinding process; (260) Polishing; (270) Unloading a wafer