发明名称 SUBSTRATE PRODUCING METHOD AND MODIFICATION LAYER FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To solve a problem wherein a conventional substrate producing method has a disadvantage for obtaining higher production efficiency.SOLUTION: A substrate producing method is used for forming a modification layer 20 on a separation projected face 30 parallel with a surface of a workpiece 10 and separating a substrate from the workpiece 10 by using the modification layer 20 as a boundary. The substrate producing method includes: a modification part forming step of forming modification parts 20a on the separation projected face 30 by disposing a condensing lens 60a so that an optical axis 50a of the condensing lens 60a is included in the separation projected face 30, making a laser beam 40a incident on the condensing lens 60a and making the laser beam 40a transmitted through the condensing lens 60a incident on the surface of the workpiece 10; a modification layer forming step of forming the modification layer 20 constituted of the plurality of modification parts 20a by repeating the modification part forming step while changing a relative positional relationship between the workpiece 10 and the condensing lens 60a; and a substrate separating step of separating the substrate from the workpiece 10 by using the modification layer 20 as a boundary.
申请公布号 JP2013141701(A) 申请公布日期 2013.07.22
申请号 JP20120004311 申请日期 2012.01.12
申请人 PANASONIC CORP 发明人 UTSURO HIDETOSHI
分类号 B23K26/38;B23K26/04;B23K26/067;B23K26/40 主分类号 B23K26/38
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