| 摘要 |
PROBLEM TO BE SOLVED: To suppress that a dielectric constant of a porous insulating film increases as time goes by.SOLUTION: First, a porous insulating film 120 is formed using an organic silica material containing a hydrocarbon group. Although the hydrocarbon group contains an unsaturated carbon compound, for example, alternatively, the hydrocarbon group may contain a saturated carbon compound. A skeleton of the organic silica is an annular organic silica, for example. Next, plasma processing of a surface of the porous insulating film 120 is performed using a process gas containing an inert gas and a reducing gas. Further, a wiring groove 123 is formed to the porous insulating film 120, and a wire 124 is embedded in the wiring groove 123. |
