| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board capable of reducing the parasitic capacity produced in a through-hole and decreasing the deterioration of transmission characteristics due to mismatching of a characteristic impedance, and provide a manufacturing method used for the multilayer printed circuit board.SOLUTION: A multilayer printed circuit board 1 has a through-hole 4 used in order to connect a signal layer 2 and the other signal layer. In the multilayer printed circuit board 1, an impedance of the signal layer 2 and an impedance of the through-hole 4 are adjusted by reducing a part of a cylinder of the through-hole 4 serving as a transmission route and changing the amount of portions to be left as the transmission route. |
